ST. FLORIAN, Austria, June 20, 2017 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today ...
ORBOTECH LTD. (NASDAQ: ORBK) today announced that SPTS Technologies, an Orbotech company and a supplier of advanced wafer processing solutions for the global semiconductor and related industries, has ...
Taking place at the end of the semiconductor process flow, dicing is the process where the silicon wafer is finally turned into individual chips, or die, traditionally by means of a saw or laser. A ...
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